Electroless deposition of CoBW coatings using morpholine borane as a reducing agent

It has been determined, that the rate of electroless deposition of the CoBW coatings and their composition depends on the concentration of disodium tungstate and reducing agent, as well as on pH and temperature of the plating solution. Electroless deposition of the CoBW coatings can be performed in a wide temperature range from 30 to 70 °C. Changing conditions of the electroless deposition of CoBW the coatings containing 5.5 to 16 at.% of boron and 5 to 14 at.% of tungsten can be obtained.