The preparation of mesoporous silica ultra-low-k film using ozone ashing treatment

The ozone ash treatment has been demonstrated to effectively remove the organic template at 200∼300 °C as well as to enhance the mechanical strength of mesoporous silica films. The resulting films are of ordered pore structure, strong mechanical strength, and smooth surface. After reacting with hexamethyldisilazane, the silica film has been modified to hydrophobic from hydrophilic and exhibits an ultra-low dielectric constant (k≤2) and a low leakage current density (10−7 A/cm2) with good electrical reliability.