Keywords: از طریق Silicon Via; Three-dimensional integration; Through silicon via; Optimization; Micrograss; Electroplating
مقالات ISI از طریق Silicon Via (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias
Keywords: از طریق Silicon Via; Tactile sensor; MEMS-on-LSI integration; Quad-seesaw-electrode structure; 3-axis force sensing; Sensor platform LSI; Through silicon via;
Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
Keywords: از طریق Silicon Via; 3D-Stacked IC; Equivalent thermal conductivity; High thermal conductivity path; Full-chip-scale simulation; 3D-SIC; three-dimensional stacked integrated circuit; TSV; through silicon via; ETC; equivalent thermal conductivity; HTCP; high thermal conductivi
A wet etching approach for the via-reveal of a wafer with through silicon vias
Keywords: از طریق Silicon Via; 3D integration; Through silicon via; Interposer; Wet etch; Backside reveal;
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
Keywords: از طریق Silicon Via; Through silicon via; Dimension parameters; Defect; Thermal behavior;
TSV by 355 UV laser for 4G component packaging with micro-electroforming
Keywords: از طریق Silicon Via; Ultraviolet laser; Through silicon via; Solidly mounted resonator; Micro-electroforming; Current density;
Temperature dependency of the strain distribution induced by TSVs in silicon: A comparative study between micro-Laue and monochromatic nano-diffraction
Keywords: از طریق Silicon Via; Strain; Stress; Through Silicon Via; Micro-Laue; Nanodiffraction; Finite elements modeling
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing
Keywords: از طریق Silicon Via; 3D IC; Through silicon via; Thermal performance; Finite element modeling; Equivalent thermal conductivity model; Thermal experiments; Uncertainty analysis;
Inductively coupled plasma etching of tapered via in silicon for MEMS integration
Keywords: از طریق Silicon Via; Inductively coupled plasma (ICP); Deep silicon etch; Tapered via; Through silicon via; Micro-electro-mechanical systems (MEMS);
Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives
Keywords: از طریق Silicon Via; Through silicon via; Copper electro-chemical deposition; Superfilling; Tafel curve;
Magnetic Field Imaging for non destructive 3D IC testing
Keywords: از طریق Silicon Via; MCI; Magnetic Current Imaging; GMR; Magnetic Field Imaging; MFI; SQUID; 3D; TSV; Through Silicon Via; Fault Isolation;
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method
Keywords: از طریق Silicon Via; Through Silicon Via; Genetic algorithm; Interval optimization; Response surface method; Equivalent plastic strain;
Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400 °C for through silicon via application
Keywords: از طریق Silicon Via; Through silicon via; Plasma enhanced chemical vapor deposition; Tetraethylorthosilicate; Conformality; Densification; Residual stress; Electrical characteristics;
Copper electrodeposition into macroporous silicon arrays for through silicon via applications
Keywords: از طریق Silicon Via; Macroporous silicon; Through silicon via; Copper electrodeposition
Enhancement of flexural stress and reduction of surface roughness through changes in gas concentrations during high-speed chemical dry thinning of silicon wafers
Keywords: از طریق Silicon Via; Silicon wafer thinning; Etching; Remote plasma; Through silicon via; X-ray photoelectron spectroscopy; Fourier transform infrared spectroscopy; Flexural stress
Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis
Keywords: از طریق Silicon Via; Through Silicon Via; Mechanical stress; Raman spectroscopy; Finite Element Analysis
Data bus swizzling in TSV-based three-dimensional integrated circuits
Keywords: از طریق Silicon Via; Data bus; Swizzling; Through silicon via; Three-dimensional integrated circuits
Optimal placement of vertical connections in 3D Network-on-Chip
Keywords: از طریق Silicon Via; 3D integration; Network-on-Chip; Through Silicon Via; Resource placement; Chip Multiprocessor
Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types
Keywords: از طریق Silicon Via; Through silicon via; Pillar bump; Solder bump; Von Mises stress;
Towards minimum material trackers for high energy physics experiments at upgraded luminosities
Keywords: از طریق Silicon Via; ATLAS; Pixel detector; Radiation length; Serial powering; Through Silicon Via; Front-End chip
Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration
Keywords: از طریق Silicon Via; Direct bonding; 3D integration; Self assembly; Through silicon via; Copper bonding; Bonding alignment
Test-access mechanism optimization for core-based three-dimensional SOCs
Keywords: از طریق Silicon Via; Three-dimensional integration; Through silicon via; Test access mechanism; Integer linear programming; Randomized rounding
The RELAXd project: Development of four-side tilable photon-counting imagers
Keywords: از طریق Silicon Via; 85.40.Ls; 87.59.Bh; 07.50.e; 87.59.HpMedipix; X-ray imaging; Wafer postprocessing; Through silicon via